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400 mhz to 4000 mhz ? watt rf driver amplifier data sheet adl5324 rev. b information furnished by analog devices is belie ved to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no li cense is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 ? 9106, u.s.a. tel: 78 1.329.4700 www.analog.com fax: 781.461.3113 ? 2012 analog devices, inc. all rights reserved. features operation from 400 m hz to 4 00 0 m hz gain of 14.6 db at 2140 mhz oip3 of 43.1 dbm at 2140 m hz p1db of 29.1 dbm at 2140 m hz noise figure of 3.8 db dynamically adjustable bias adjustable p ower supply bias : 3.3 v to 5 v low power supply current: 62 ma to 133 ma no bias resistor needed operating temperature range of ? 40c to +105c sot - 89 package, msl - 1 rated esd rating of 3 kv (class 2 ) applications wireless i nfrastructure automated t est e quipment ism/amr a pplications functional block dia gram gnd 1 2 bias 3 gnd adl5324 (2) rfin rfout 10562-001 figure 1. general description the adl5324 incorporates a dynamically adjustable biasing circuit that allows for the customization of oip3 and p1db performance from 3.3 v to 5 v, without the need for an external bias resistor. this feature gives the desi gner the ability to tailor driver amplifier performance to the specific needs of the design. this feature also creates the opportunity for dynamic biasing of the driver amplifier where a variable supply is used to allow for full 5 v biasing under large sig nal conditions, and then reduced supply voltage when signal levels are smaller and lower power consumption is desirable. this scalability reduces the need to evaluate and inventory multiple driver amplifiers for different output power requirements, from 25 dbm to 29 dbm output power levels . the adl5324 is also rated to operate across the wide temperature range of ? 40c to +105c for reliable p erformance in designs that experience higher temperatures, such as power amplifiers. the ? w driver amplifier also covers the wide frequency range of 400 mhz to 4 000 m hz, and only requires a few external components to be tuned to a specific band within that wide range . this high performance broadband rf driver amplifier is well suited for a variety of wired and wireless applications , including cellular infrastructure, ism band power amplifiers, defense equipment, and instrument ation equipment. a fully populated evaluation board is available. the adl5324 also delivers excellent acpr vs. output power and bias voltage. the driver can deliver greater than 17 dbm of output power at 2140 mhz, while achieving an acpr of ?55 dbc at 5 v. if the bias is reduced to 3.3 v , the ? 55 dbc acpr output power only minimally reduces to 15 dbm. 10562?055 ?85 ?80 ?75 ?70 ?65 ?60 ?55 ?50 ?45 ?40 ?35 ?30 ?20 ?15 ?10 ?5 0 5 10 15 20 25 acpr @ 5mhz carrier offset (dbc) p out (dbm) source v cc = 3. 3v v cc = 5v figure 2 . acpr vs. output power, single carrier w - cdma, tm1 - 64 at 2140 mhz
adl5324 data sheet rev. b | page 2 of 20 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 typical scattering parameters ..................................................... 5 absolute maximum ratings ............................................................ 6 thermal resista nce ...................................................................... 6 esd caution .................................................................................. 6 pin configuration and function descriptions ............................. 7 typical performance characteristics ..............................................8 high temperature operation ................................................... 12 applications information .............................................................. 13 basic layout connections ......................................................... 13 soldering information and recommended pcb land pattern . 13 matching procedure ................................................................... 15 w- cdma acpr performance ................................................ 16 evaluation board ............................................................................ 17 out line dimensions ....................................................................... 20 ordering guide .......................................................................... 20 revision history 9 /12 rev. a to rev. b changes to figure 27 ...................................................................... 11 changed figure 30 tex t reference to figure 33 text refer ence ... 12 changed table 7 text reference to table 6 ................................. 15 changed table 9 text reference to table 10 and table 10 text reference to table 11 ..................................................................... 17 changes to figure 44 ...................................................................... 18 8 /12 rev. 0 to rev. a change 5 v supply current from 140 ma to 133 ma and 5 v power dissipa tion from 700 mw to 665 mw , table 1 ................. 4 changes to supply current from 140 ma to 133 ma ............... 13 3/ 12 rev ision 0: initial version
data sheet adl5324 rev. b | page 3 of 20 specifications vsup = 5 v and t a = 25c, unless otherwise noted. table 1. 3.3 v 5 v parameter test c onditions/comments min t yp max min typ max unit frequency = 457 mhz gain 17.2 18.4 db vs. frequency 37 mhz +0. 0 /?0. 4 +0. 0 /?0. 2 db vs. temperature ?40c t a +8 5c 0. 6 0. 6 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 3 0.07 db output 1 db compression point 24.2 28.0 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 dbm per tone 30.1 40.1 dbm noise figure 5.6 6.8 db frequency = 748 mhz gain 16.5 17.5 db vs. frequency 2 0 m hz +0. 0 /?0. 2 +0. 0 /?0. 2 db vs. temperature ?40c t a +8 5c 0. 4 0. 4 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.06 db output 1 db compression point 24.2 28.0 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 db m per tone 36.0 45.8 dbm noise figure 4.0 5.2 db frequency = 915 mhz gain 1 15.8 16.0 16.8 17.6 db vs. frequency 46 mhz 0. 1 +0. 1 /?0. 3 db vs. temperature ?40c t a +8 5c 0. 4 0. 4 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.06 db output 1 db compression point 24.2 27.7 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 dbm per tone 39.3 45.6 dbm noise figure 4.1 5.1 db frequency = 1935 mhz gain 13.9 15.0 db vs . frequency 55 mhz +0.0 /?0. 1 +0.0 /?0. 1 db vs. temperature ?40c t a +8 5c 0. 5 0. 5 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.07 db output 1 db compression point 23.2 27.2 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 dbm per tone 34.6 45.5 dbm noise figure 3.1 3.6 db frequency = 2140 mhz gai n 1 13.6 13.5 14.6 15.7 db vs. frequency 3 0 mhz +0. 1 /?0 .0 0. 1 db vs. temperature ?40 c t a +8 5c 0. 6 0. 6 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.06 db output 1 db compression point 25.3 29.1 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 dbm per tone 34.4 43.1 dbm noise figure 3.2 3.8 db
adl5324 data sheet rev. b | page 4 of 20 3.3 v 5 v parameter test c onditions/comments min t yp max min typ max unit frequency = 263 0 mhz gain 1 12.1 11.8 13.3 14.6 db vs. frequency 6 0 mhz 0. 1 +0.0/?0.2 db vs. temperature ?40c t a +8 5c 0. 7 0. 7 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.07 db output 1 db compression point 23.6 27.8 dbm output third - order intercept ?f = 1 mhz , p out = 1 0 dbm per tone 32.4 42.0 dbm noise figure 3.6 4.3 db frequency = 3 600 mhz gain 11.0 12.0 db vs. fr equency 100 mhz +0.0/?0.7 +0.0/?0.8 db vs. temperature ?40c t a + 8 5c 1.0 1.0 db vs. supply 3.15 v to 3.45 v, 4.75 v to 5.25 v 0. 2 0.05 db output 1 db compression point 25.0 28.5 dbm output third - order intercept ?f = 1 mh z , p out = 1 0 dbm per tone 29.3 36.6 dbm noise figure 3.8 4.4 db power interface pin rf out supply voltage 3.15 3.3 3.45 4.75 5 5.25 v supply current 62 133 ma vs. temperature ?40c t a +85c +4 /? 6 +5 /? 7 ma power d issipation vsup = 5 v 205 665 mw 1 guaranteed maximum and minimum specified limits on this parameter are based on six sigma calculations.
data sheet adl5324 rev. b | page 5 of 20 typical scattering p arameters vsup = 5 v and t a = 25 c; the effects of the test fixture have been de - embedded up to the pins of the device. table 2. freq (mhz) s11 s21 s12 s22 magnitude ( db) angle () magnitude (db) angle () magnitude (db) angle () magnitude (db) angle () 400 ? 0.73518 ? 178.582 13.3917 135.7023 ? 34.6804 12.40754 ? 3.04567 175.7277 500 ? 0.6682 178.6472 12.83594 125.9539 ? 34.2707 8.733014 ? 3.13245 175.9202 600 ? 0.69026 176.9348 12.14674 117.8626 ? 34.1019 6.416618 ? 3.13132 176.4634 700 ? 0.73622 175.8152 11.44082 111.0321 ? 34.0009 5.053048 ? 3.11375 177.3131 800 ? 0.78026 175.0847 10.7709 105.1552 ? 33.9042 3.90523 ? 3.08891 178.3368 900 ? 0.8238 174.5898 10.17296 99.91559 ? 33.7964 3.162531 ? 3.05337 179.4021 1000 ? 0.8703 174.2026 9.636511 95.21821 ? 33.6656 2.580227 ? 3.01719 ? 179.377 1100 ? 0.9211 173.9872 9.182607 91.01039 ? 33.5057 2.111382 ? 2.98741 ? 177.773 1200 ? 0.97114 173.3143 8.797653 86.68882 ? 33.3176 1.186726 ? 2.94972 ? 176.469 1300 ? 1.05332 172.9788 8.493785 82.89921 ? 33.0916 0.689198 ? 2.9749 ? 174.745 1400 ? 1.13807 172.418 8.268673 79.01047 ? 32.8261 ? 0.26086 ? 2.99624 ? 173.189 1500 ? 1.23342 171.5538 8.117951 74.96804 ? 32.5253 ? 1.43036 ? 3.02533 ? 171.783 1600 ? 1.34406 170.302 8.030017 70.69309 ? 32.1979 ? 3.08241 ? 3.04592 ? 170.675 1700 ? 1.47125 168.6736 7.99834 8 66.16438 ? 31.8306 ? 5.10232 ? 3.05748 ? 169.736 1800 ? 1.61396 166.5204 8.012977 61.23666 ? 31.4647 ? 7.75224 ? 3.08106 ? 169.23 1900 ? 1.78541 163.8113 8.0503 55.89288 ? 31.0967 ? 10.9203 ? 3.12034 ? 169.149 2000 ? 1.98158 160.6247 8.103461 50.12853 ? 30.7409 ? 14.6 71 ? 3.15588 ? 169.657 2100 ? 2.19535 157.0149 8.162658 43.95115 ? 30.4109 ? 19.0255 ? 3.18172 ? 170.862 2200 ? 2.43367 153.0489 8.207579 37.39437 ? 30.1134 ? 23.849 ? 3.19212 ? 172.621 2300 ? 2.68863 148.8413 8.231765 30.52801 ? 29.872 ? 29.1849 ? 3.17831 ? 174.879 2400 ? 2.95983 144.5491 8.231791 23.39294 ? 29.6822 ? 35.0026 ? 3.13204 ? 177.553 2500 ? 3.25472 140.354 8.199665 16.05117 ? 29.5353 ? 41.1796 ? 3.05541 179.4875 2600 ? 3.56594 136.4445 8.141897 8.510386 ? 29.4496 ? 47.7908 ? 2.94631 176.2481 2700 ? 3.90734 133.0736 8.052657 0.787456 ? 29.4307 ? 54.7743 ? 2.79325 172.8794 2800 ? 4.28173 130.4779 7.925075 ? 7.06584 ? 29.451 ? 62.1914 ? 2.57604 169.6831 2900 ? 4.69306 128.952 7.778394 ? 15.0835 ? 29.5362 ? 69.9289 ? 2.31023 166.7304 3000 ? 5.13012 128.7774 7.590076 ? 23.2924 ? 29.673 ? 78.1809 ? 2.00734 164.1571 3100 ? 5.54712 130.3019 7.355608 ? 31.6367 ? 29.8658 ? 86.8436 ? 1.69231 162.0214 3200 ? 5.86482 133.6487 7.062082 ? 40.2413 ? 30.1507 ? 96.2073 ? 1.37649 160.0906 3300 ? 5.98131 138.5443 6.680613 ? 48.9518 ? 30.5191 ? 106.08 ? 1.0663 158.44 85 3400 ? 5.80159 144.0974 6.20792 ? 57.556 ? 30.9857 ? 116.217 ? 0.80053 157.172 3500 ? 5.34159 149.2672 5.63213 ? 65.9828 ? 31.5373 ? 126.686 ? 0.58238 156.1642 3600 ? 4.7127 153.2749 4.988874 ? 73.9355 ? 32.1461 ? 137.413 ? 0.41604 155.491 3700 ? 4.03208 155.8906 4 .279792 ? 81.4065 ? 32.7942 ? 148.125 ? 0.30331 155.1641 3800 ? 3.37391 157.3335 3.543499 ? 88.1911 ? 33.4212 ? 158.775 ? 0.23714 155.0734 3900 ? 2.79798 157.8681 2.803935 ? 94.5028 ? 33.9833 ? 169.303 ? 0.20674 155.156 4000 ? 2.30194 157.7622 2.085365 ? 100.344 ? 34.3781 ? 179.983 ? 0.20598 155.3378
adl5324 data sheet rev. b | page 6 of 20 absolute maximum rat ings table 3. parameter rating supply voltage, vsup 6.5 v input power ( 50 impedance ) 20 dbm internal power dissipation ( paddle soldered ) 1.9 w maximum junction temperature 150 c operating temperature range ?40c to + 105c storage temperature range ?65c to +150c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the devi ce at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. thermal resistance table 4 li sts the junction - to - air thermal resistance ( ja ) and the junction - to - paddle thermal resistance ( jc ) for the adl5324 . table 4 . thermal resistance package type ja 1 jc 2 unit 3- lead sot - 89 37 9 c/w 1 measured on analog devices evaluation b oard. for more information about board layout, see the soldering information and recommended pcb land pattern section. 2 based on simulation with jedec standard jesd51 . e sd ca ution
data sheet adl5324 rev. b | page 7 of 20 pin configuration and function descripti ons rfin gnd rfout 1 2 3 gnd adl5324 top view (not to scale) (2) 10562-002 figure 3 . pin configuration table 5 . pin function descriptions pin o. mnemonic description 1 rf in rf input. this pin r equires a dc blocking capacitor. 2 gnd ground. connect this pin to a low impedance ground plane. note that the paddle, which is exposed, encompasses pin 2 and the tab at the top side of the package. it should be soldered to a low impedance ground plane for electrical grounding and thermal transfer. 3 rf out rf output and supply voltage. dc bias is provided to this pin through an inductor that is connected to the external power supply. the rf path requires a dc blocking capacitor.
adl5324 data sheet rev. b | page 8 of 20 typical performance characteristics 50 0 869 884 900 915 930 946 961 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 5 10 15 20 25 30 35 40 45 oip3 (dbm) p1db (dbm) gain (db) nf (db) 10562-015 figu re 4 . gain, p1db , oip3, and noise figure vs. frequency , 869 mhz to 96 1 mhz 17.5 15.5 16.0 16.5 17.0 869 884 900 915 930 946 961 gain (db) frequency (mhz) ?40c +25c +85c 10562-016 figure 5 . gain vs. frequency and temperature , 869 mhz to 961 mhz 0 ?10 ?15 ?5 ?40 869 961 s-parameters (db) frequency (mhz) ?30 ?35 ?25 ?20 884 900 915 930 946 s11 s12 s22 10562-017 figure 6. input return loss (s11 ) , output return loss (s22), and reverse isolation (s12) vs. frequenc y , 869 mhz to 96 1 mhz ?40c ?40c 35 25 869 884 900 915 930 946 961 p1db (dbm) oip3 (dbm) frequency (mhz) +25c +85c +85c 30 32 34 36 38 40 42 44 46 48 50 26 27 28 29 30 31 32 33 34 +25c 10562-018 figure 7 . oip3 and p1db vs. frequency and temperature , 869 mhz to 96 1 mhz 55 35 ?5 0 5 10 15 20 oip3 (dbm) p out per tone (dbm) 37 39 41 43 45 47 49 51 53 869mhz 915mhz 961mhz 10562-019 figure 8 . oip3 vs. p out and freq uency , 869 mhz to 96 1 mhz 7 3 869 961 noise figure (db) frequency (mhz) 5 4 6 884 900 915 930 946 +85c +25c ?40c 10562-020 figure 9 . noise figure vs. frequency and temperature , 869 mhz to 96 1 mhz
data sheet adl5324 rev. b | page 9 of 20 50 0 2110 2120 2130 2140 2150 2160 2170 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 5 10 15 20 25 30 35 40 45 oip3 (dbm) p1db (dbm) gain (db) nf (db) 10562-027 figure 10 . gain, p1db , oip3, and noise figure vs. frequency , 2110 mhz to 2170 mhz 16.0 15.5 15.0 14.5 14.0 13.5 13.0 2110 2120 2130 2140 2150 2160 2170 gain (db) frequency (mhz) 10562-028 ?40c +25c +85c figure 11 . gain vs. frequency and temperature, 2110 mhz to 2170 mhz 0 ?10 ?15 ?5 ?40 2110 2170 s-parameters (db) frequency (mhz) ?30 ?35 ?25 ?20 2120 2130 2140 2150 2160 s12 10562-029 s11 s22 figure 12 . input return loss (s11), output return loss (s22), and reverse isolation (s12) vs. frequenc y, 2110 mhz to 2170 mhz ?40c ?40c 35 25 2110 2120 2130 2140 2150 2160 2170 p1db (dbm) oip3 (dbm) frequency (mhz) +85c +85c 28 30 32 34 36 38 40 42 44 46 48 26 27 28 29 30 31 32 33 34 10562-030 +25c +25c figure 13 . oip3 and p1db vs. frequency and temperature, 2110 mhz to 2170 mhz 10562-031 21 10mhz 2140mhz 2170mhz 50 48 30 42 40 38 36 34 32 44 46 ?5 0 5 10 15 20 oip3 (dbm) p out per tone (dbm) figure 14 . oip3 vs. p out and frequency, 2110 mhz to 2170 mhz 10562-032 6 5 2 2110 2170 noise figure (db) frequency (mhz) 3 4 2120 2130 2140 2150 2160 ?40c +25c +85c figure 15 . noise figure vs. frequency and tempera ture , 2110 mhz to 2170 mhz
adl5324 data sheet rev. b | page 10 of 20 10562-033 50 0 2570 2690 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 5 10 15 20 25 30 35 40 45 2590 2610 2630 2650 2670 oip3 (dbm) p1db (dbm) gain (db) nf (db) figure 16 . gain, p1db , oip3, and noise figure vs. frequency , 2570 mhz to 2690 mhz 14.5 14.0 13.5 13.0 12.5 12.0 11.5 2570 2590 2610 2630 2650 2670 2690 gain (db) frequency (mhz) 10562-034 ?40c +25c +85c figure 17 . gain vs. frequency and temperature, 2570 mhz to 2690 mhz 0 ?10 ?15 ?5 ?40 2570 2690 s-parameters (db) frequency (mhz) ?30 ?35 ?25 ?20 2590 2610 2630 2650 2670 s12 10562-035 s11 s22 figure 18 . input return loss (s11), output return loss (s22), and reverse isolation (s12) vs. frequenc y, 2570 mhz to 2690 mhz ?40c ?40c 34 24 25 2570 2590 2610 2630 2650 2670 2690 p1db (dbm) oip3 (dbm) frequency (mhz) +85c +85c 28 30 32 34 36 38 40 42 44 46 48 26 27 28 29 30 31 32 33 10562-036 +25c +25c figure 19 . oip3 and p1db vs. frequency and temperature, 2570 mhz to 2690 mhz 10562-037 2570mhz 2630mhz 2690mhz 50 48 30 42 40 38 36 34 32 44 46 ?5 0 5 10 15 20 oip3 (dbm) p out per tone (dbm) figure 20 . oip3 vs. p out and frequency, 2570 mhz to 2690 mhz 10562-038 7 6 3 2570 2690 noise figure (db) frequency (mhz) 4 5 2590 2610 2630 2650 2670 ?40c +25c +85c figure 21 . noise figure vs. frequency and temperature , 2570 mhz to 2690 mhz
data sheet adl5324 rev. b | page 11 of 20 10562-045 30 25 20 15 10 5 0 41.2 41.6 42.0 42.4 42.8 43.6 43.2 44.0 44.4 44.8 percentage (%) oip3 (dbm) figure 22 . oip3 distribution at 2140 mhz 10562-046 50 45 25 30 35 40 20 15 10 5 0 28.2 28.4 28.6 28.8 29.0 29.2 29.4 29.6 29.8 30.0 percentage (%) p1db (dbm) figure 23 . p1db distribution at 2140 mhz 40 35 30 0 5 10 15 20 25 14.3 14.4 14.5 14.6 14.7 14.8 14.9 15.0 15.1 15.2 percentage (%) gain (db) 10562-047 figure 24 . gain distribution at 2140 mhz 10562-048 25 20 15 10 5 0 3.45 3.50 3.55 3.60 3.65 3.70 3.75 3.853.80 3.90 percentage (%) noise figure (db) figure 25 . noise figure distribution at 2140 mhz 200 100 ?40 ?20 0 20 40 60 80 supply current (ma) temperature (c) 10562-049 110 120 130 140 150 160 170 180 190 5v 4.75v 5.25v figure 26 . supply current vs. supply voltage and temperature , 5 v (using 2140 mhz matching components) 100 0 ?40 ?20 0 20 40 60 80 supply current (ma) temperature (c) 10562-064 10 20 30 40 50 60 70 80 90 3.3v 3.15v 3.45v figure 27 . supply current vs. supply vol tage and temperature , 3.3 v (using 2140 mhz matching components)
adl5324 data sheet rev. b | page 12 of 20 high temperature ope ra tion the adl5324 has excellent performance at temperatures above 85c. at 105c, the gain and p1db decrease by 0.2 db, the oip3 decreases by 0.1 db, and the noise figure increases by 0.31 db compared with the data at 85c. figure 28 through figure 33 show the performance at 105c. 12.0 12.5 13.0 13.5 gain (db) 14.0 14.5 15.0 21 10 2120 2130 2140 frequenc y (mhz) 2150 2160 2170 25c 85c 105c 10562-134 figure 28 . gain vs. frequency and temperature, 5 v s upply, 2140 mhz 23 28 33 38 43 48 23 25 27 29 31 33 21 10 2120 2130 2140 2150 2160 2170 oip3 (dbm) p1db (dbm) 25c 85c 105c frequenc y (mhz) oi p3 p1db 10562-135 figure 29 . oip3 and p1db vs. frequency and temperature, 5 v s upply, 2140 mhz 2 3 4 5 6 21 10 2120 2130 2140 f requenc y (mhz) noise figure (db) 2150 2160 2170 25c 85c 105c 10562-136 figure 30 . noise figure vs. frequency and temperature, 5 v s upply, 2140 mhz gain (db) 21 10 2120 2130 2140 frequenc y (mhz) 2150 2160 2170 25c 85c 105c 10562-137 12.0 12.5 13.0 13.5 14.0 14.5 15.0 figure 31 . gain vs. frequency and temperature, 3.3 v s upply, 2140 mhz 23 28 33 38 43 48 23 25 27 29 31 33 21 10 2120 2130 2140 2150 2160 2170 oip3 (dbm) p1db (dbm) 25c 85c 105c frequenc y (mhz) oi p3 p1db 10562-138 figure 32 . oip3 and p1db vs. f requency and temperature, 3.3 v s upply, 2140 mhz 2 3 4 5 6 21 10 2120 2130 2140 f requenc y (mhz) noise figure (db) 2150 2160 2170 25c 85c 105c 10562-139 figure 33 . noise figure vs. f requency and temperature, 3.3 v s up ply, 2140 mhz
data sheet adl5324 rev. b | page 13 of 20 applications informa tion basic layout c onnections the basic connections for operating the adl5324 are shown in figure 34. table 6 lists the required matching components. capacitors c1, c2, and c3 are murata grm615 series (0402 size) high q capacitors and c7 is a murata grm155 series (0402 size) . inductor l1 is a coilcraft 0603cs series (0603 size). for all frequency bands, t he placement of c1 and c2 are critical . the placement of c3 becomes critical for the following bands: 1880 mhz to 1990 mhz, 2110 mhz to 2170 mhz, 2300 mhz to 2400 mhz, 2570 mhz to 2690 mhz . and 3500 mhz to 3600 mhz. for operation from 420 mhz to 494 mhz, 7 28 mhz to 768 mhz , and 869 mhz to 960 mhz , r2 is replaced with a c oilcraft ( 0402 size ) high q inductor. table 7 lists the recommended component placement for various frequencies. a 5 v dc bias is supplied through l 1 , which is connected to rfout (pin 3). in addition to c4, 10 nf and 10 f power supply decoupling capacitors are also required. the typical current consumption for the adl5324 is 133 ma. rfin gnd gnd rfout 1 2 (2) 3 adl5324 c6 10f c5 10nf c4 100pf l1 15nh vsup gnd rfin c7 20pf c2 3 2.2pf rfout c1 3 2pf c3 3 2.4pf 1 2 2 2 1 see the recommended components for basic connections t able for frequenc y -specific components. 2 see table 6 for recommended component spacing. 3 c1, c2, and c3 are mur at a high q ca p aci t ors grm615 series. r1 0? r2 0? 10562-050 figure 34 . basic connections soldering information and recommended pcb land pattern figure 35 shows the recommended land pattern for the adl5324 . to minimize th ermal impedance, the exposed paddle on the sot - 89 package underside is soldered to a ground plane along with pin 2 . if multiple ground layers exist, they should be stitched together using vias . for more information on land patter n design and layout, refer to the application note an - 772, a design and manufacturing guide for the lead frame chip scale package (lfcsp) . thi s land pattern, on the adl5324 evaluation b oard, provides a measured thermal resistance ( ja ) of 37c/w. to measure ja , the temperature at the top of the sot - 89 package is found with an ir tempera ture gun . thermal simulation suggests a junction temperature 10c higher than the top of package temperature. with addi tional ambient temperature and i/o power measurements, ja could be determined. 0.86mm 10562-051 5.56mm 0.20mm 1.80mm 1.27mm 0.62mm 3.48mm 1.50mm 3.00mm figure 35 . recommended land pattern
adl5324 data sheet rev. b | page 14 of 20 table 6 . recommended components for basic connections function/ component 42 0 mhz to 494 mhz 728 mhz to 768 mhz 800 mhz to 960 mhz 1880 mhz to 1990 mhz 2110 mhz to 2170 mhz (default) 2300 mhz to 2400 mhz 2560 mhz to 2690 mhz 3500 mhz to 3700 mhz ac coupling capacitors c3 = 0402 10 pf 10pf 1 10 pf 1 2.4 pf 1 2.4 p f 1 2.4 pf 1 2pf 1 1pf 1 c7 = 0402 20 pf 20 pf 20 pf 20 pf 20 pf 20 pf 20 pf 1 20 pf power supply bypassing capacitors c4 = 0402 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf c5 = 0603 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf c6 = 1 206 10 f 10 f 10 f 10 f 10 f 10 f 10 f 10 f dc bias inductor 120 nh 18 nh 18 nh 15 nh 15 nh 15 nh 15 nh 15 nh l1 = 0603cs tuning capacitors c1 = 0402 20 pf 1 8 pf 1 8 pf 1 2.4 pf 1 2.0 pf 1 1.5 pf 1 1.0 pf 1 0.5 pf 1 c2 = 0402 6.2 pf 1 3.9 pf 1 3.6 pf 1 2.4 pf 1 2.2 pf 1 2.0 pf 1 2.0 pf 1 0.75 pf 1 jumpers r1 = 0402 2 2 2 0 0 0 0 0 r2 = 0402 5.6 nh 2 2.4 nh 3 2.4 nh 3 0 0 0 0 4. 7 nh 3 power supply connections vsup red test loop gnd black test loop 1 murata hi gh q capacitor. 2 add a 1.6 nh at input (see figure 41 ). 3 coilcraft 0402cs series. ta ble 7 . matching component spacing frequency (mhz) 1 (mils) 2 (mils) 420 to 494 419 438 728 to 768 311 422 869 to 961 207 413 1880 to 1990 75 239 2110 to 2170 65 193 2300 to 2400 71 176 2570 to 2690 245 132 3500 to 3700 316 125
data sheet adl5324 rev. b | page 15 of 20 matching procedure the adl5324 is designed to achieve excellent gain and o ip3 performance. to achieve this, both input and output matching networks must present specific impedance to the device. the matching components listed in table 6 were chosen to provide ?10 db input return loss while maximizing oip3. the load - pull plots ( see figure 36 and figure 37 ) show the load impedance points on the smith chart where optimum oip3, gai n, and output power can be achieved. these load impedance values (that is, the impedance that the device sees when looking into the output matching network) are listed in table 8 and table 9 for maximum gain and maximum oip3, respectively. the contours show how each parameter degrades as it is moved away from the optimum point. f rom the data shown in table 8 and table 9 , it becomes clear that maximum gain and maximum oip3 do not occur at the same impedance. this can also be seen on the load - pull contours in figure 36 and figure 37 . thus, output matching generally involves compromising between gain and oip3. in addition, the load - pull plots demonstrate that the quality of the output impedance match must be compromised to optimize gain and/or oip3. in most appli cations where line lengths are short and where the next device in the signal chain presents a low input return loss, compromising on the output match is acceptable. to adjust the output match for operation at a different frequency , or if a different trade - off between oip3, gain, and output impedance is desired, a four - step procedure is recommended. for example, to optimize the adl5324 for optimum oip3 and gain at 7 5 0 mhz , use the following steps: 1. install the re commended tuning components for an 869 mhz to 9 7 0 mhz tuning band, but do not install c 1 and c 2. 2. connect the evaluation board to a vector network analyzer so that input and output return loss can be viewed simultaneously. 3. starting with the recommended valu es and positions for c1 and c2, adjust the positions of these capacitors along the transmission line until the return loss and gain are acceptable . in this case, p ush- down capacitors mounted on small sticks can be used as an alternative to soldering. if mo ving the component positions does not yield satisfactory results, then increase or decrease the values of c 1 and c 2 ( in this case, the values are most likely increased because the user is tuning for a lower frequency . 4. r epeat step 3 as necessary. once the desired gain and return loss are realized, measure oip3. most likely, it will be necessary to go back and forth between return loss/gain and oip3 measurements (probably compromising most on output return loss) until an acceptable compromise is achieved. 10562-053 fixed load pull freq = 2.1400 ghz zsource_2nd (ohms) : 50.00 + j 0.00 zsource_3rd (ohms) : 50.00 + j 0.00 gt max = 16.06 db at 2.97 ? j 2.70 ohms 10 contours, 0.50 db step (11.50 to 16.00 db) ip3 max = 44.18 dbm at 9.44 + j 9.65 ohms 10 contours, 1.00 dbm step (35.00 to 44.00 dbm) specs: off load label: adl5324_2p14_lp7 figure 36 . load - pull contours , 2140 mhz 10562-054 fixed load pull freq = 2.6300 ghz zsource (ohms) : 49.84 + j 4.33 zsource_2nd (ohms) : 37.79 + j 3.28 zsource_3rd (ohms) : 39.74 + j10.00 gt max = 13.83 db at 4.27 ? j 1.99 ohms 10 contours, 0.50 db step (9.00 to 13.50 db) ip3 max = 45.19 dbm at 2.84 + j 5.89 ohms 10 contours, 1.00 dbm step (36.00 to 45.00 dbm) specs: off load label: adl5324_2p63ghz_lp3 26.37 + j30.90 figure 37 . load - pull contours , 2600 mhz table 8 . load conditions for gain max fre qu ency (mhz) load (magnitude) load () gain max (db) 2140 0.888 ?173.55 16.1 2630 0.0843 ?175.41 13.83 table 9 . load conditions for o ip3 max frequency (mhz) load (magnitude) load () ip3 max ( dbm) 2140 0.654 +163.28 44.18 2630 0.894 + 166.52 45.19
adl5324 data sheet rev. b | page 16 of 20 w- cdma acpr performanc e figure 38 shows a plot of adjacent channel power ratio (acpr) vs. p out for the adl5324 . the signal type used is a single w - cd ma carrier (test model 1 - 64) at 2140 mhz. this signal is generated by a very low acpr source. acpr is measured at the output by a high dynamic range spectrum analyzer, which incorporates an instrument noise correction function. the adl5324 achieves an acpr of ? 79 dbc at 0 dbm output, at which point device noise and not distortion is beginning to dominate the power in the adjacent channels. at an output power of 10 dbm, acpr is still very low at ?7 2 dbc , making the device particularly suitable for pa driver applications. 10562?155 ?85 ?80 ?75 ?70 ?65 ?60 ?55 ?50 ?45 ?40 ?35 ?30 ?20 ?15 ?10 ?5 0 5 10 15 20 25 acpr @ 5mhz carrier offset (dbc) p out (dbm) source v cc = 3. 3v v cc = 5v figure 38 . acpr vs. output power, single carrier w - cdma, tm1 - 64, at 2140 mhz
data sheet adl5324 rev. b | page 17 of 20 evaluation board the schematic of the ad l5324 evaluation board is shown in figure 39 . this evaluation board uses 25 mil wide traces and is made from fr4 material. the evaluation board comes tuned for operation in the 2110 mhz to 2170 mhz tuning band. tuning options for other frequency bands are also provided in table 10 . the recommended placement for these components is provided in table 11 . the inputs and outputs should be ac - coupled wi th appropriately sized capacitors. dc bias is provided to the amplifier via an inductor connected to the rfout pin. a bias voltage of 5 v is recommended. rfin gnd gnd rfout 1 2 (2) 3 adl5324 c6 10f c5 10nf c4 100pf l1 15nh vsup gnd rfin c7 20pf c2 3 2.2pf rfout c3 1 2.4pf c1 2 2pf 1 4 2 4 1 murata high q capacitor grm615cog2r4b50 or equivalent. 2 murata high q capacitor grm615cog020b50 or equivalent. 3 murata high q capacitor grm615cog2r2b50 or equivalent. 4 see table 10 for recommended component spacing. r1 0? r2 0? 10562-056 figure 39 . evaluation board, 2110 mhz to 2170 mhz r2 0 ? r1 0? c3 2.4pf 100 pf l1 15nh c7 20 pf c2 2.2pf 193mils 65mils c1 2pf 10562-057 figure 40 . evaluation board layout and default component placement for 2110 mhz to 2170 mhz table 10 . recommended components for basic connections function/ component 420 mhz to 494 mhz 728 mhz to 768 mhz 800 mhz to 960 mhz 18 80 mhz to 1990 mhz 2110 mhz to 2170 mhz (default) 2300 mhz to 2400 mhz 2560 mhz to 2690 mhz 3500 mhz to 3700 mhz ac coupling capacitors c3 = 0402 10 pf 10pf 1 10 pf 2.4 pf 1 2.4 pf 1 2.4 pf 1 2pf 1 1pf 1 c7 = 0402 20 pf 20 pf 20 pf 20 pf 20 pf 20 pf 20 pf 1 20 pf power supply bypassing capacitors c4 = 0402 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf 100 pf c5 = 0603 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf 10 nf c6 = 1206 10 f 10 f 10 f 10 f 10 f 10 f 10 f 10 f dc bias inductor 120 nh 18 nh 18 nh 15 nh 15 nh 15 nh 15 nh 15 nh l1 = 0603cs tuning capacitors c1 = 0402 20 pf 1 8 pf 1 8 pf 1 2.4 pf 1 2.0 pf 1 1.5 pf 1 1.0 pf 1 0.5 pf 1 c2 = 0402 6.2 pf 1 3.9 pf 1 3.6 pf 1 2.4 pf 1 2.2 pf 1 2.0 pf 1 2.0 pf 1 0.75 pf 1 ju mpers r1 = 0402 2 2 2 0 0 0 0 0 r2 = 0402 5.6 nh 2 2.4 nh 3 2.4 nh 3 0 0 0 0 4. 7 nh 3 power supply connections vsup red test loop gnd black test loop 1 murata hi gh q capacitor. 2 add a 1.6 nh at input (see figure 41 ). 3 coilcraft 0402cs series.
adl5324 data sheet rev. b | page 18 of 20 table 11 . recommended component spacing on evaluation board frequency (mhz) 1 (mils) 2 (mils) 420 to 494 419 438 728 to 768 311 422 869 to 961 207 413 1880 to 1990 75 239 2110 to 2170 65 193 2300 to 2400 71 176 2570 to 2690 245 132 3500 to 3700 316 125 438 mils c7 20pf c2 6.2pf l2 5.6nh r1 2? 100 pf 248 mils c3 10pf c1 20pf l1 120nh 311 mils l3 1.6nh 419 mils 10562-042 figure 41 . evaluation board layout and component placement , 420 mhz to 494 mhz operation 422 mils c7 20pf c2 3.9pf l2 2.4nh r1 2? 100pf c3 10pf c1 8pf l1 18nh 311 mils 10562-043 figure 42 . evaluation board layout and comp onent placement , 728 mhz to 768 mhz operation 413mils 100pf c3 10pf c1 8pf 207mils r1 2? l1 18nh c7 20pf c2 3.6pf l2 2.4nh 10562-060 figure 43 . evaluation board layout and component placement , 869 mhz to 96 1 mhz operation 10562-061 239m il s c7 20 pf c2 2.4pf r2 0 ? r1 0 ? 100 pf 75mil s c3 2.4pf c1 2.4pf l1 15 nh figure 44 . evaluation board layout and component placement, 1880 mhz to 1990 mhz operation
data sheet adl5324 rev. b | page 19 of 20 176mils 100pf r1 0? c3 2.4pf 71mils c1 1.5pf l1 15nh c7 20pf r2 0? c2 2.0pf 10562-062 figure 45 . evaluation board layout and component placement , 230 0 mhz to 2 40 0 mhz operation 132mils 100pf 245mils r1 0? c1 1.0pf c3 2.0pf r2 0? c7 20pf c2 2.0pf l1 15nh 10562-063 figure 46 . evaluation board layout and component placement , 25 6 0 mhz to 2 69 0 mhz operation 125 mils c7 20pf c2 0.75pf l2 4.7nh r1 0? 100pf c3 1.0pf c1 0.5pf l1 15nh 316 mils 10562-148 figure 47 . evaluation board layout and component placement , 350 0 mhz to 370 0 mhz operation
adl5324 data sheet rev. b | page 20 of 20 outline dimensions * compliant to jedec standards to-243 with the exception of dimensions indicated by an asterisk. 4.25 3.94 4.60 4.40 * 1.75 1.55 1.50 typ 3.00 typ end view 2.60 2.30 1.20 0.75 1 2 (2) 3 2.29 2.14 * 0.56 0.36 * 0.52 0.32 1.60 1.40 0.44 0.35 12-18-2008-b figure 48 . 3- lead small outline transistor package [sot - 89] (rk - 3) dimensions shown in millimeters ordering guide model 1 temperature range package description package option ad l5324 arkz -r7 ?40c to +10 5c 3- lead sot - 89, 7 tape and reel rk -3 adl532 4- evalz evaluation board 1 z = rohs compliant part. ? 2012 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d10562 -0- 9 / 12(b)

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